The questions we get asked most often, grouped the way a sourcing decision actually happens rather than the way a website is organized: who you are dealing with, what we can build, what it takes to get a number, how the build is controlled, and what happens when the component market misbehaves.
Each group can be read on its own. Jump to the one that matches where you are in the evaluation, or read straight through — every answer is short enough to scan.
These questions are about the supplier as an entity, not the product: what the operation actually covers, where the plants are, which sectors it builds for, and whether the size of your program is welcome.
Vortixion is a contract electronics manufacturer working with OEM and EMS customers. The scope covers PCB fabrication, component sourcing coordination, SMT assembly, through-hole insertion, functional testing, conformal coating, potting, wire harness, injection molding, box build and final product assembly.
In practice that means a single supplier can carry a product from bare board through assembled board to a boxed, packaged unit, rather than you coordinating a board house, an assembler and a box builder separately.
Production resources sit in Dongguan, Guangdong Province, China and in Luong Dien, Cam Dien commune, Cam Giang district, Hai Duong Province, Vietnam, with the commercial head office in Hong Kong.
The dual-base structure exists for two reasons. It mitigates tariff exposure by allowing production to be allocated to either country, and it widens logistics options for customers shipping to different regions. The Vietnam plant passed ISO 9001 in 2022 and ISO 14001 in 2023.
The published product range spans industrial and power electronics (inverter control boards, temperature controller boards), energy storage and battery management (protection boards for home storage), smart devices and IoT (pet tracker assemblies, ONU units for FTTH networks), consumer appliances such as coffee machine control boards, and LED lighting and controllers.
Because the same lines run rigid, flex and rigid-flex work, the sector matters less than the board: what changes between industries is the test coverage and the documentation, not the placement process.
Both. Our capacity scales from low-volume, high-mix prototyping through to high-volume continuous runs, and low-volume assembly is supported — 5 units for testing or 500 units for a market pilot.
The practical consequence is that an engineering team can validate a design with the same supplier that later takes it to volume, without re-qualifying the build basis.
These are the numbers to check against your board before sending anything. If the stack-up, the package types and the board outline all fit, the quote is a pricing exercise rather than a feasibility study.
1 to 36 layers in rigid, flex and rigid-flex, with FR4, Rogers, PTFE, polyimide and metal-core materials. Board outline goes up to 1320 × 570 mm, thickness up to 10 mm, and copper weight up to 6 oz.
Impedance is controlled to ±10%, with the measured tolerance held at ±5%. Surface finishes include ENIG, lead-free HASL, immersion silver, immersion tin and OSP.
From prototype PCB assembly through to mass production, the same three build types are run: SMT (surface mount), through-hole assembly and mixed technology — not a specialist line held back for difficult work. Where a design needs dense interconnects, the bare board is fabricated to an HDI BGA pitch of 0.35 mm with minimum via and pad of 0.05 mm and 0.15 mm, so the pitch limit sits in fabrication rather than in placement.
Yes. Box build is offered as a full service covering PCB integration, plastic injection molding for enclosures, wire harness installation and final retail packaging. Conformal coating and potting are available as part of the same build.
This is the difference between receiving assembled boards and receiving a finished, packaged product ready for distribution.
Yes. Turnkey assembly covers component sourcing, PCB fabrication, assembly and final testing, so the supply chain sits with the manufacturer rather than with you. Because sourcing, fabrication, assembly and test sit in one organization, a component problem comes back as a single answer instead of three separate supplier conversations.
Both are quoted, either together or separately. Because fabrication and assembly sit in the same organization, the bare board is inspected before it reaches the assembly line — flying probe and 100% AOI are run at the fabrication stage so open and short circuits are caught before components are placed.
These are the commercial questions that most often stall an evaluation. Where we publish two figures for the same thing — a quote turnaround, a minimum quantity — both are given here rather than the more flattering one.
The baseline is a Gerber file and a BOM. A faster and more accurate quote comes from adding schematics, pick-and-place data, test requirements, the product application, expected quantity, target lead time, and any requirements for coating, potting, enclosure, cable or final assembly.
A physical sample or a written product requirement can also open a review when files are not yet finalized.
Send the Gerber files and BOM through the contact form. The engineering team reviews the requirements, and a detailed quotation is returned within 24–48 hours.
That is the pricing turnaround. Where the RFQ also needs DFM feedback and an agreed build basis — a first-article discussion, a test plan, a component substitution — allow 2 to 4 business days before the quote is final. Both are given because they answer different questions.
Two different figures get called a minimum. Low-volume assembly is supported: 5 units for testing, 500 units for a market pilot.
For standard wholesale orders of a mature product, the typical MOQ is 500 pieces — the same figure as a pilot run, which is why the two are easy to confuse. Exact minimums are confirmed per board, because panel utilization and component reeling affect what is economic far more than a fixed number does.
Prototyping: 7–10 business days. Bare PCB mass production: 12–18 business days after final Gerber verification, depending on layer count and HDI requirements. Mass production of more than 5,000 units: typically 3–4 weeks, depending on component availability.
Component availability is the variable that actually moves a date, which is why the quotation carries a date rather than a generic duration.
Volume pricing is tiered rather than flat. For bare boards, tiered volume discounts start from 500 square meters, while prototypes are produced in low quantities without that tier applying.
Assembly pricing separates the recurring cost of material and processing from non-recurring items such as tooling, stencils and test fixtures, so a repeat order does not pay twice for the same setup.
Testing is not one gate at the end. Fabrication is inspected before assembly, assembly is inspected before test, and the documentation that proves it is agreed at the quoting stage rather than promised afterwards.
Inspection is layered across the route: DFM review before tooling, incoming component control, AOI (automated optical inspection) after placement, X-Ray for BGA and hidden joints, and functional testing (FCT) against the agreed test plan.
Bare boards are additionally run through 100% AOI and flying probe or fixture electrical test to eliminate open and short circuits prior to assembly.
IPC-A-610 and IPC-J-STD-001 govern workmanship, with bare boards held to IPC Class 2 and Class 3 depending on the application. Flammability and safety compliance references UL94V0 and UL 796F.
Material compliance is quoted as RoHS and REACH. If your acceptance criteria are stricter than Class 3, state them in the RFQ so they can be quoted rather than assumed.
ISO 9001 for quality and ISO 13485 for medical device work are held at company level; our bare-board operation runs under ISO 9001 and IATF 16949. The Vietnam plant passed ISO 9001 in 2022 and ISO 14001 in 2023, and UL-listed products have shipped since 2012.
Certificate numbers and the legal entity named on each certificate should be confirmed in writing during supplier approval — a group holding several entities will not hold every certificate under the same company name.
Boards are built under controls intended to pass FCC, CE and RoHS requirements for the markets named at RFQ, and compliance preparation is treated as part of the build rather than an afterthought.
What a manufacturer supports is not the same as what it certifies: the certificate is issued to your product by a test house. Ask for the specific evidence you need — material declarations, test reports, design review notes — and confirm it is in scope before ordering.
Inspection and test records accompany the build. For impedance-controlled boards this can include TDR test reports; for other projects the document set is agreed during the RFQ, since the useful depth varies with the application.
If your quality department requires first-article data, certificates of conformance or specific acceptance records, name them in the RFQ. Documentation that is not requested is not always generated.
Most of the cost in a bad build is decided before the first component is placed. These are the questions about design review, data formats and confidentiality.
Yes — DFM and DFT feedback is provided at no charge, aimed at cost, reliability and manufacturability. The review looks at panelization, component placement around test points, solderability and how the build will scale, not just whether the files open.
Feedback is most useful before tooling and batch planning are fixed, because a change at that point costs a design revision; the same change after stencils and fixtures exist costs a re-qualification.
Gerber and BOM are the baseline that every quote starts from. Where standardized data exchange is available — IPC-2581 is the format designed for this — the DFM review can read intent as well as geometry, which catches more before it becomes rework.
Yes. PCB files, a BOM, schematics, a physical sample or a written product requirement can each open a review. Where only a sample exists, the first step is establishing what the build basis actually is — layer count, material, finish and test coverage — before any quotation is meaningful.
Design files are used for review and production only. A non-disclosure agreement can be put in place before files are shared, and it is reasonable to ask for that in writing at the RFQ stage rather than after the quote.
It is also reasonable to ask which entities and sites will see the data, particularly where two production bases are involved.
The question is rarely whether a supplier can build the first batch. It is what happens in the quarter when a part goes on allocation.
Long-term relationships with tier-one component suppliers and distributors are maintained specifically so supply stays stable during market shortages. Risk mitigation is planned into the program rather than improvised when a part disappears.
Where a substitution is unavoidable, it is a decision that belongs to you: ask for the proposed alternate, the datasheet comparison and the effect on test coverage before approving it.
Yes — VMI (vendor managed inventory) and JIT (just-in-time) programs are offered to reduce cash tied up in material and lower overhead, while protecting the production schedule.
These arrangements are usually set up once a program has a repeatable forecast; on a first build the material is normally bought against the order.
The dual-base structure exists to allow exactly that. Reallocating a program between the two sites is the mechanism behind the tariff mitigation and the logistics flexibility, and both sites operate EMS facilities.
A move between sites is a change to the build basis, so it should be agreed with the customer and re-confirmed against the inspection and documentation requirements rather than treated as an internal matter.
Send it with your files and you get both back in one reply — a priced, dated quotation and a straight answer to whatever is still open.
